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PolyFlex Products Joins Reusable Packaging Association; Will Exhibit in RPA Reusable Packaging Pavilion at PACK EXPO

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Arlington, VA, May 27, 2014 – PolyFlex Products has joined the Reusable Packaging Association and will exhibit in the sold-out Reusable Packaging Pavilion at PACK EXPO. The company engineers and manufactures custom reusable trays, returnable containers, and other packaging products for transportation and process applications.

“We look forward to leveraging the business tools and marketing opportunities provided by the RPA,” said Lauren Ennis, Marketing Specialist at PolyFlex Products. “We want to associate our business with other reputable providers of products, services, and information about reusables.”

About PolyFlex Products
PolyFlex Products help companies reduce shipping costs related to packing, logistics, processing and ergonomical uses. Its goal is to help companies ship more product at lighter weight and lesser cost. The company uses a range of processes including injection molding,

RIM urethane molding, and thermoforming. Learn more at

About the RPA at PACK EXPO
The RPA stages three important educational platforms annually at PACK EXPO.  They are the Reusable Packaging Pavilion, the Reusables Learning Center, and the RPA Networking Reception. The Reusable Packaging Pavilion is a popular one-stop resource for companies interested in implementing reusables into their supply chain, or strengthening the return on their existing reusable assets. This year, the Pavilion brings together 37 exhibitors including man­u­fac­tur­ers, mate­r­ial sup­pli­ers, providers of wash­ing and other spe­cialty equip­ment, and pool­ers and ser­vice providers of reusable pack­ag­ing sys­tems and solu­tions, all exhibiting within one highly vis­i­ble and con­ve­nient loca­tion. The Reusables Learning Center is located within the Pavilion. A series of informative sessions about reusables are presented in the center, directly on the show floor. The RPA Reusable Packaging Pavilion and Reusables Learning Center will be in the Lakeside Center of McCormick Place at PACK EXPO in Chicago 2014. The RPA Networking Reception is an opportunity for attendees to ask questions and network with suppliers and RPA members. CHEP, IFCO Systems, and Rehrig Pacific Company are headline sponsors of RPA activities at PACK EXPO.

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